Zero power IC module

Details Zero power IC module Zero power IC module

1990-06-06

1992-02-18

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 75, 361380, 361394, 174 524, H01L 2348, H01L 2302, H05K 500, H05K 506

Patent

active

050898779

ABSTRACT:
An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a finger lead assembly encapsulated within a body of non-conductive material, with a central base support finger lead being offset within an interconnect region. One terminal of the battery is welded to the offset base finger lead, and the integrated circuit chip is bonded directly onto the other battery terminals by a layer of conductive epoxy. The stacked assembly of the integrated circuit chip, the battery and the offset base finger lead is centered longitudinally and vertically within the interconnect region whereby the stacked assembly, including gold interconnect wires, are completely encapsulated within the molded package body, without increasing the standoff height of the package.

REFERENCES:
patent: 4142287 (1979-03-01), Grabbe
patent: 4539660 (1985-09-01), Miyauchi et al.
patent: 4616655 (1986-10-01), Weinberg et al.

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