Zero capacitance bondpad utilizing active negative capacitance

Details Zero capacitance bondpad utilizing active negative capacitance Zero capacitance bondpad utilizing active negative capacitance

2006-12-12

2006-12-12

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257SE23153, C257SE23167, C257SE27024, C257SE21022, C257S471000, C257S759000, C257S773000, C257S383000, C257S435000, C257S774000, C257S775000, C257S755000, C257S528000, C257S532000, C257S734000, C257S786000, C257S784000, C257SE23020, C257SE23144

Reexamination Certificate

active

07148535

ABSTRACT:
The present invention is an apparatus and system for reducing bondpad capacitance of an integrated circuit. Circuitry of the present invention may produce a negative capacitance approximately equal in magnitude to the capacitance associated with the bondpad and thereby effectively eliminate the bondpad capacitance. Values of the components of the circuitry may be selectively and independently chosen to synthesize a variable range of negative capacitance and thus produce a negative capacitance approximately equal in magnitude to a unique capacitance associated with the bondpad of a variety of integrated circuits.

REFERENCES:
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patent: 6385019 (2002-05-01), Gagne et al.
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patent: 2002/0117693 (2002-08-01), Dodabalapur et al.
patent: 2005/0047064 (2005-03-01), Singh
patent: 2005/0104157 (2005-05-01), Coolbaugh et al.
patent: 2005/0230783 (2005-10-01), Lin

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