Yield-enhancing methods of providing a family of scaled...

Details Yield-enhancing methods of providing a family of scaled... Yield-enhancing methods of providing a family of scaled...

2006-01-17

2009-02-17

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S014000, C438S017000, C438S128000

Reexamination Certificate

active

07491576

ABSTRACT:
An integrated circuit die (e.g., a programmable logic device (PLD) die) is manufactured that has the capability of being configured as at least two differently-sized family members. The IC die is tested prior to packaging. If a first portion of the IC die is fully functional, but a second portion includes a localized defect, then the IC die is packaged with a product selection code that configures the IC die to operate as only the first portion of the die. The second portion of the die is deliberately rendered non-operational. Therefore, the IC die can still be sold as a fully functional packaged IC.

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