X-ray exposure apparatus and semiconductor-device manufacturing

X-ray or gamma ray systems or devices – Specific application – Lithography

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

378 97, 378204, G21K 500

Patent

active

053475615

ABSTRACT:
X-rays enter an airtight chamber through a beam duct, pass through a transmission window, and expose a wafer and mask disposed outside the airtight chamber. The wafer and mask are held by a wafer chuck and a mask holder, respectively. The mask holder includes a pressure sensor, which detects variations in the atmospheric pressure. An output from the pressure sensor is converted into a change in the intensity of the x-rays by an arithmetic unit, and is transmitted to a control unit, which controls a driving unit of a shutter. By thus controlling the moving speed of the shutter in accordance with variations in the atmospheric pressure, it is possible to prevent variations in the amount of x-ray exposure of the wafer.

REFERENCES:
patent: 5134640 (1992-07-01), Hirokawa et al.
patent: 5170418 (1992-12-01), Ebinuma
patent: 5172403 (1992-12-01), Tanaka
Patent Abstracts of Japan, Kokai No. 61-035450, vol. 10, No. 190, Jul. 1986.
Patent Abstracts of Japan, Kokai No. 02-100311, vol. 14, No. 308, Jul. 1990.
Patent Abstracts of Japan, Kokai No. 03-101216, vol. 15, No. 288, Jul. 1991.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

X-ray exposure apparatus and semiconductor-device manufacturing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with X-ray exposure apparatus and semiconductor-device manufacturing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and X-ray exposure apparatus and semiconductor-device manufacturing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1126240

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.