Wrapping member for semiconductor device and method for manufact

Details Wrapping member for semiconductor device and method for manufact Wrapping member for semiconductor device and method for manufact

1990-10-12

1992-08-11

Sewell, Paul T.

Package making

Methods

Forming or partial forming a receptacle and subsequent filling

206330, B65D 7302

Patent

active

051368277

ABSTRACT:
A wrapping member for holding semiconductor devices comprises a carrier tape and a seal tape. The carrier tape is embossed to form depressed portions, each of which is adapted to receive one semiconductor device. The seal tape is adhered to the carrier tape in a manner to successively cover the depressed portions. A thin metallic film is formed on the surface of at least one of the carrier tape and the seal tape.

REFERENCES:
patent: 4156751 (1979-05-01), Yenni, Jr. et al.
patent: 4223512 (1980-09-01), Buchner
patent: 4702788 (1987-10-01), Okui
patent: 4712675 (1987-12-01), Scholten et al.
patent: 4724958 (1988-02-01), Kaneko et al.
patent: 4736841 (1988-04-01), Kameko et al.
patent: 4790433 (1988-12-01), Raszewski
patent: 4792042 (1988-12-01), Koehn et al.
European Search Report, EP 89 11 2268, Oct. 24, 1990, and Annex to European Search Report, Oct. 24, 1990.

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