Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-14
2009-11-10
Levi, Dameon E (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S728000, C361S730000, C174S050500, C174S521000, C174S050510
Reexamination Certificate
active
07616448
ABSTRACT:
An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.
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European Search Report dated Nov. 21, 2008.
Brandenburg Scott D.
Chow Kin Yean
Degenkolb Thomas A.
Fang Ching Meng
Mandel Larry M.
Delphi Technologies Inc.
Funke Jimmy L.
Levi Dameon E
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