Workpiece transfer apparatus and electronic component...

Conveyors: power-driven – Conveyor having impinging fluid to feed – shift or discharge...

Reexamination Certificate

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Details

C198S393000, C198S608000, C198S689100

Reexamination Certificate

active

08033382

ABSTRACT:
An electronic-component conveying apparatus that conveys an electronic component by holding the electronic component in a through hole provided in a conveying table of the apparatus, in which the electronic component can be quickly and reliably dismounted from the through hole by using compressed gas, and undesired popout of the electronic component due to a residual pressure infrequently occurs, whereby the efficiency in the conveying process can be increased. A workpiece conveying apparatus includes a blowhole opening in a conveying surface of a conveying stage and configured such that an electronic component held in a through hole is dismounted by using compressed gas at a position where the through hole overlaps the blowhole while a conveying table is driven, a vacuum groove communicating with the blowhole and provided in a first surface of the conveying table, and an auxiliary blowhole connected to a compressed-gas supply device and opening in the conveying surface such as to be accessible to the vacuum groove.

REFERENCES:
patent: 2831587 (1958-04-01), Rearick
patent: 4346722 (1982-08-01), Schregenberger
patent: 5842579 (1998-12-01), Garcia et al.
patent: 6906508 (2005-06-01), Saulnier et al.
patent: 2002/0050443 (2002-05-01), Kurabe et al.
patent: 2004/0159591 (2004-08-01), Kojima et al.
patent: 1733576 (2006-02-01), None
patent: 2002-68471 (2002-03-01), None
patent: 2002-068471 (2002-03-01), None
patent: 2004-226101 (2004-08-01), None
patent: 2006-027881 (2006-02-01), None
patent: 2006-27881 (2006-02-01), None
International Search Report with English language translation.
Written Opinion with English language translation.
Taiwan Office Action received Apr. 8, 2010.
Chinese Office Action issued Dec. 14, 2010 in connection with corresponding Chinese Patent Application No. 200780015272.7 (JP2004-226101 was previously filed in an IDS submitted Oct. 6, 2008 and is therefore not enclosed.).

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