Workpiece surface processing apparatus

Details Workpiece surface processing apparatus Workpiece surface processing apparatus

1999-01-21

2000-05-30

Banks, Derris Holt

Abrading

Machine

Rotary tool

451287, 451272, B24B 500, B24B 2900

Patent

active

06068545&

ABSTRACT:
A workpiece surface processing apparatus capable of processing the surface of a workpiece without being limited as to the shape of the workpiece and further capable of measuring the state of polish of the workpiece with a high precision. The workpiece surface processing apparatus includes three platens 1-1 to 1-3 arranged substantially point symmetrically and being rotated in the same direction by motors 17 to 19, a carrier head 2 holding a wafer W and rotating in an opposite direction to the platens 1-1 to 1-3, a rocking mechanism 3 for making the wafer W rock in a diametrical direction of the platen 1-1 so that the entire surface of the wafer W is polished. A measuring device 4 continuously measures the state of polish of the entire surface of the wafer W.

REFERENCES:
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5435772 (1995-07-01), Yu
patent: 5674109 (1997-10-01), Kanzawa et al.
patent: 5791969 (1998-08-01), Lund
patent: 5800253 (1998-09-01), Ikemoto
patent: 5868605 (1999-02-01), Cesna

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