Workpiece holder for rotary grinding machines for grinding semic

Abrading – Work holder – Work rotating

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Details

451287, 451285, 451388, 451405, B24B 500

Patent

active

055671993

ABSTRACT:
A workpiece holder for rotary grinding machines for grinding semiconductor afers has a rotatable work surface which points toward a rotating grinding tool and on which the semiconductor wafer to be machined is laid, and has piezoelectric elements on which the workpiece holder is axially supported. The piezoelectric elements can be operated independently of one another and, when operated, undergo a change in their linear dimension, an operated piezoelectric element axially raising or lowering the workpiece holder at the point at which it supports the workpiece holder. There is also a method for positioning the workpiece holder.

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patent: 5320007 (1994-06-01), Weirauch
Derwent Abstract pertaining to DE 41 36 882.
Derwent Abstract pertaining to DE 35 24 690.

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