Electrical computers and digital processing systems: support – Computer power control
Reexamination Certificate
2004-08-31
2008-11-04
Connolly, Mark (Department: 2115)
Electrical computers and digital processing systems: support
Computer power control
C709S223000, C709S224000, C709S226000, C718S100000, C718S104000
Reexamination Certificate
active
07447920
ABSTRACT:
A method of workload placement among servers includes receipt of a workload request. The method also includes selection of a group of servers from a set of servers capable of performing the requested workload. In addition, server workload indexes, which are ratios of temperature rises due to re-circulation load for the servers in the group of servers to temperature rises due to re-circulation load for the set of servers, of the servers in the group of servers are calculated. Moreover, the workload is placed on one or more of the servers in the group of servers based upon the server workload indexes of the servers in the group of servers.
REFERENCES:
patent: 6795928 (2004-09-01), Bradley et al.
patent: 6889908 (2005-05-01), Crippen et al.
patent: 7058826 (2006-06-01), Fung
patent: 7197433 (2007-03-01), Patel et al.
patent: 2003/0193777 (2003-10-01), Friedrich et al.
patent: 2005/0023363 (2005-02-01), Sharma et al.
patent: 2006/0259622 (2006-11-01), Moore et al.
patent: 2006/0259793 (2006-11-01), Moore et al.
Bianchini et al., Power and Energy Management for Server Systems, Nov. 2004, IEEE, pp. 68-76.
Sharma et al., Balance of Power: Dynamic Thermal Management for Internet Data Centers, Feb. 18, 2003, pp. 1-13.
Bash Cullen E.
Friedrich Richard J.
Patel Chandrakant D.
Sharma Ratnesh K.
Connolly Mark
Hewlett--Packard Development Company, L.P.
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