Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent
1997-10-09
1999-10-19
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
216 23, 216102, 347147, 438609, 438673, 438713, 438719, H01L 2100, B44C 122
Patent
active
059688505
ABSTRACT:
A wiring according to the present invention is made of a chromium layer and a chromium nitride layer. To make the wiring, a layer of chromium is deposited on a substrate, and then a layer of chromium nitride is deposited. A layer of photoresist is covered on the layer of chromium nitride and patterned, the layers of chromium and chromium nitride are wet etched in sequence using the photoresist pattern as a mask. Since the layer of chromium nitride is etched more quickly than the layer of chromium, the layer of photoresist and the layer of chromium are separated from each other and the chromium layer is isotropically etched to form a pattern having an edge with a gentle slope.
REFERENCES:
patent: 4970368 (1990-11-01), Yamazaki et al.
patent: 5234541 (1993-08-01), Shannon
patent: 5792705 (1998-08-01), Wang et al.
Jeong Cheol-Su
Jeong Jong-In
Kwon Chul-Ho
Lee Chul-Yong
Park Dae-Won
Powell William
Samsung Electronics Co,. Ltd.
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