Wiring substrate, solid-state imaging apparatus using the...

Details Wiring substrate, solid-state imaging apparatus using the... Wiring substrate, solid-state imaging apparatus using the...

2009-12-31

2011-11-08

Ho, Tuan (Department: 2622)

Television

Camera, system and detail

Optics

Reexamination Certificate

active

08054370

ABSTRACT:
In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

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patent: 5418566 (1995-05-01), Kameishi
patent: 2001358997 (2001-12-01), None
patent: 2002246574 (2002-08-01), None
patent: 2003158252 (2003-05-01), None
patent: 2004-031932 (2004-01-01), None

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