Wiring substrate produced by transfer material method

Details Wiring substrate produced by transfer material method Wiring substrate produced by transfer material method

2005-08-30

2005-08-30

Chambliss, Alonzo (Department: 2814)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C029S876000, C029S879000

Reexamination Certificate

active

06936774

ABSTRACT:
A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

REFERENCES:
patent: 4244605 (1981-01-01), Deneau
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4797508 (1989-01-01), Chant
patent: 5141790 (1992-08-01), Calhoun et al.
patent: 5309629 (1994-05-01), Traskos et al.
patent: 5407511 (1995-04-01), Nakatani et al.
patent: 5408053 (1995-04-01), Young
patent: 5546375 (1996-08-01), Shimada et al.
patent: 5667884 (1997-09-01), Bolger
patent: 5689879 (1997-11-01), Urasaki et al.
patent: 5699613 (1997-12-01), Chong et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5776662 (1998-07-01), Shirai et al.
patent: 5855716 (1999-01-01), Tonucci et al.
patent: 5951803 (1999-09-01), Johnston
patent: 6000603 (1999-12-01), Koskenmaki et al.
patent: 6060150 (2000-05-01), Nakatani et al.
patent: 6138348 (2000-10-01), Kulesza et al.
patent: 6143116 (2000-11-01), Hayashi et al.
patent: 6195882 (2001-03-01), Tsukamoto et al.
patent: 6320140 (2001-11-01), Enomoto
patent: 6359235 (2002-03-01), Hayashi
patent: 6370013 (2002-04-01), Iino et al.
patent: 6373000 (2002-04-01), Nakamura et al.
patent: 6459046 (2002-10-01), Ochi et al.
patent: 1106822 (1961-05-01), None
patent: 0 525 956 (1993-02-01), None
patent: 568 930 (1993-11-01), None
patent: 0 629 110 (1994-12-01), None
patent: 645 950 (1995-03-01), None
patent: 651 602 (1995-05-01), None
patent: 0 960 725 (1999-12-01), None
patent: 1 102 355 (2001-05-01), None
patent: 999183 (1965-07-01), None
patent: 60-55691 (1985-03-01), None
patent: 60-164392 (1985-08-01), None
patent: 6-132667 (1994-05-01), None
patent: 7-142867 (1995-06-01), None
patent: 8-125291 (1996-05-01), None
patent: 8-125308 (1996-05-01), None
patent: 8-288596 (1996-11-01), None
patent: 2587596 (1996-12-01), None
patent: 8-330709 (1996-12-01), None
patent: 2601128 (1997-01-01), None
patent: 2603053 (1997-01-01), None
patent: 9-36551 (1997-02-01), None
patent: 9-51168 (1997-02-01), None
patent: 9-116267 (1997-05-01), None
patent: 9-270584 (1997-10-01), None
patent: 9-326562 (1997-12-01), None
patent: 10-41611 (1998-02-01), None
patent: 10-51139 (1998-02-01), None
patent: 10-84186 (1998-03-01), None
patent: 10-173097 (1998-06-01), None
patent: 10-173316 (1998-06-01), None
patent: 10-190191 (1998-07-01), None
patent: 11-135946 (1999-05-01), None
patent: 11220262 (1999-08-01), None
patent: 11-261219 (1999-09-01), None
patent: 2000-15742 (2000-01-01), None
patent: 2001-210933 (2001-08-01), None
patent: 220027 (1994-02-01), None
patent: 340297 (1998-09-01), None
Handbook of Electronic Packaging, Mc-Graw-Hill, 1969, pp. 1-17 and 1-21.

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