Stock material or miscellaneous articles – Composite
Patent
1995-07-10
1998-05-19
Krynski, William
Stock material or miscellaneous articles
Composite
428195, 428457, 4284735, B32B 904
Patent
active
057533725
ABSTRACT:
The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).
REFERENCES:
patent: 2936296 (1960-05-01), Precopio et al.
patent: 3837819 (1974-09-01), Hibbs, Jr.
patent: 4217389 (1980-08-01), Peterson
patent: 4400226 (1983-08-01), Horrigan
Journal of Vacuum Science and Technology, A, pp. 1402-1412, vol. 7, No. 3, (1989) "A Study of the chemical and physical interaction between . . . ".
Journal of Vacuum Science and Technology, A, pp. 55-58, vol. 7, No. 1, (1989) "Interfacial reactions at copper surfaces coated with . . . ".
Journal of Vacuum Science and Technology, A, vol. 9, No. 6, pp. 2963-2974, (1991) "Oxygen induced adhesion degradation at metal/polyimide interface".
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 3, No. 2 (1990) pp. 440-443 "A Pillar-Shaped Via Structure . . . ".
"Copper (1)" by N. De Zoubov, C. Vanleugenhaghe, and M. Pourbaix, Section 14.1, pp. 384-387 undated.
"Oxygen (1)" by N. De Zoubov and M. Pourbaix, Section 19.1, pp. 540-543 undated.
Akamatsu Shirou
Ikeda Shogi
Kataoka Fumio
Matsushima Naoki
Matsuyama Haruhiko
Hitachi , Ltd.
Krynski William
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