Wiring structure and semiconductor device, and their...

Details Wiring structure and semiconductor device, and their... Wiring structure and semiconductor device, and their...

2008-06-18

2011-12-20

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S637000, C438S652000, C438S675000, C257S773000, C257SE23142, C257SE21575

Reexamination Certificate

active

08080470

ABSTRACT:
A fabrication method for a wiring structure of the present invention includes: a process of forming a conductive wiring layer; a process of forming a wiring pattern on the wiring layer; a process of forming an insulative wiring interlayer film between wires of the wiring pattern; and a process of forming a plurality of longitudinal hole-shaped fine pores in the wiring interlayer film in a thickness direction of the wiring interlayer film by etching with a mask including one of nano-particles and material including nano-particles.

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