Wiring patterned film and production thereof

Details Wiring patterned film and production thereof Wiring patterned film and production thereof

1998-05-15

2000-05-30

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

666692, H01L 2348, H01L 2352

Patent

active

060694068

ABSTRACT:
A wiring patterned film wherein a gold lead 18 which extends from a wiring pattern formed on the adhesive side of a resin film adhered to the side of a semiconductor element on which an electrode terminal is formed, and which bridges a window section opening on the resin film, is cut off at a prescribed location facing the window section and bent so that the lead tip is connected to the electrode terminal, wherein a notch section is formed at a prescribed location of the gold lead 18 bridging the window section to facilitate cutting of the gold lead 18, and at least the narrowest part of the notch section 42a is formed into an upward protruding convex curve at the surface opposite the back side facing the window section.

REFERENCES:
patent: 2758797 (1956-08-01), Miklau
patent: 3374537 (1968-03-01), Doelp, Jr.
patent: 3460105 (1969-08-01), Birt et al.
patent: 4234666 (1980-11-01), Gursky
patent: 5177863 (1993-01-01), Lam
patent: 5309316 (1994-05-01), Yagi et al.
patent: 5844779 (1998-12-01), Choi

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