Wiring pattern forming method, film pattern forming method,...

Details Wiring pattern forming method, film pattern forming method,... Wiring pattern forming method, film pattern forming method,...

2005-10-04

2009-11-24

Everhart, Caridad M (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S584000, C257S098000, C257SE33044, C257SE21580

Reexamination Certificate

active

07622385

ABSTRACT:
A wiring pattern forming method which is a method of forming a wiring pattern by using a liquid droplet ejection method on a preset area on a substrate, includes:forming a bank on the preset area on the substrate;ejecting a functional liquid including a wiring pattern material on an area surrounded by the bank and drying the functional liquid to form the wiring pattern; andremoving part of the bank so as to make a height of the bank and a thickness of the wiring pattern approximately the same.

REFERENCES:
patent: 5329695 (1994-07-01), Traskos et al.
patent: 5587342 (1996-12-01), Lin et al.
patent: 5832595 (1998-11-01), Maruyama et al.
patent: 6946159 (2005-09-01), Takahashi et al.
patent: 7109107 (2006-09-01), Prather et al.
patent: 2003/0059987 (2003-03-01), Sirringhaus et al.
patent: 2005/0122351 (2005-06-01), Yamazaki et al.
patent: 2006/0063111 (2006-03-01), Ali et al.
patent: 2007/0173053 (2007-07-01), Fukuchi
patent: 02-132831 (1990-05-01), None
patent: 05-006942 (1993-01-01), None
patent: 08-250590 (1996-09-01), None
patent: 10-313009 (1998-11-01), None
patent: 11-095024 (1999-04-01), None
patent: 11-274671 (1999-10-01), None
patent: 2000-353594 (2000-12-01), None
patent: 2003043243 (2003-02-01), None
patent: 2003-139935 (2003-05-01), None
patent: 2003-273111 (2003-09-01), None
patent: 2003-317945 (2003-11-01), None
patent: 10-2004-0023758 (2004-03-01), None
patent: 10-2004-0030304 (2004-04-01), None

Affiliated with

Also associated with

Rating

Wiring pattern forming method, film pattern forming method,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring pattern forming method, film pattern forming method,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring pattern forming method, film pattern forming method,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4070991