Wiring method

Details Wiring method Wiring method

2007-11-20

2007-11-20

Sarkar, Asok K. (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

Insulated gate formation

C438S585000

Reexamination Certificate

active

11156578

ABSTRACT:
A method of forming a wiring in a thin-film transistor includes a step of providing a bank having a groove defined thereon, a step of placing a liquid material in a wiring formation area of the by depositing droplets of the liquid material, and a step of placing the liquid material in a secondary area. The groove has the wiring formation area and the secondary area that are contiguously connected with each other. The liquid material contains a structural material for the wiring. The per unit amount of the liquid material placed in the secondary area is smaller than the per unit amount of the liquid material deposited in the wiring formation area.

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Hayes et al., Development and Application by Ink-Jet Printing of Advanced Packaging Materials, 1999 International Symposium on Advanced Packaging Materials, pp. 88-93.

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