Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2007-09-10
2009-08-04
Huff, Mark F (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S317000, C430S318000, C430S323000, C430S324000, C430S005000, C430S314000
Reexamination Certificate
active
07569333
ABSTRACT:
The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is formed on the barrier layer and both sides of the metal layer. A method for fabricating the wiring line structure is also disclosed.
REFERENCES:
patent: 4464459 (1984-08-01), Majima et al.
patent: 4810332 (1989-03-01), Pan
patent: 6627523 (2003-09-01), Pyo
patent: 6969889 (2005-11-01), Cho et al.
patent: 2001/0023131 (2001-09-01), Wu et al.
patent: 2004/0207084 (2004-10-01), Hedrick et al.
patent: 2004/0232443 (2004-11-01), Cho et al.
patent: 2005/0242401 (2005-11-01), Cho et al.
patent: 2006/0124153 (2006-06-01), Yun et al.
patent: 1610859 (2005-04-01), None
Huang Kuo-Yu
Lin Hui-Fen
Liu Yu-Wei
Tsai Tzeng-Guang
Au Optronics Corp.
Huff Mark F
Sullivan Caleen O
Thomas Kayden Horstemeyer & Risley LLP
LandOfFree
Wiring line structure and method for forming the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wiring line structure and method for forming the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring line structure and method for forming the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4078018