Wiring line structure and method for forming the same

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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Details

C430S317000, C430S318000, C430S323000, C430S324000, C430S005000, C430S314000

Reexamination Certificate

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07569333

ABSTRACT:
The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is formed on the barrier layer and both sides of the metal layer. A method for fabricating the wiring line structure is also disclosed.

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patent: 6969889 (2005-11-01), Cho et al.
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patent: 2004/0232443 (2004-11-01), Cho et al.
patent: 2005/0242401 (2005-11-01), Cho et al.
patent: 2006/0124153 (2006-06-01), Yun et al.
patent: 1610859 (2005-04-01), None

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