Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-02-27
2007-02-27
Pham, Thanhha S. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S698000, C257S100000
Reexamination Certificate
active
10483175
ABSTRACT:
A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.
REFERENCES:
patent: 6586686 (2003-07-01), Enomoto et al.
patent: 8-18181 (1996-01-01), None
patent: 9-17828 (1997-01-01), None
patent: 90 17828 (1997-01-01), None
patent: 9147625 (1997-06-01), None
patent: 9-321184 (1997-12-01), None
patent: 10-284836 (1998-10-01), None
patent: 11-177234 (1999-07-01), None
patent: 11-186681 (1999-07-01), None
patent: 2001-189550 (2001-07-01), None
patent: WO 00/36886 (2000-06-01), None
Ishikawa Takao
Kamoto Daigoro
Miwa Takao
Motowaki Shigehisa
Naito Takashi
Dickstein , Shapiro, LLP.
Pham Thanhha S.
Renesas Technology Corp.
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