Wiring circuit board and production method thereof

Details Wiring circuit board and production method thereof Wiring circuit board and production method thereof

2006-08-01

2006-08-01

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S643000, C438S099000

Reexamination Certificate

active

07084493

ABSTRACT:
In the vicinity of the exposed part1A of the multiply formed plural wiring conductors1, of the thicknesses of the insulating cover layer2made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors1is made smaller than the thickness (T2) of a part located on wiring conductor1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer2and that of a part located on wiring conductor is made to fall within the range of 1–5 μm. As a result, the insulating cover layer does not peel off easily.

REFERENCES:
patent: 6117616 (2000-09-01), Omote et al.
patent: 6623843 (2003-09-01), Fujii et al.
patent: 2002/0132095 (2002-09-01), Fujii et al.

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