Wiring board with connection electrode formed in opening and...

Details Wiring board with connection electrode formed in opening and... Wiring board with connection electrode formed in opening and...

2005-08-04

2008-11-25

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23021, C257SE23068, C257SE21512, C257S734000, C257S737000, C257S738000, C257S682000, C257S780000, C257S782000, C257S746000

Reexamination Certificate

active

07456502

ABSTRACT:
The invention provides a wiring board (2,15) to which a semiconductor chip (3) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board includes a connection electrode (14) that is formed on a bonding surface (2a, 15a) to which the semiconductor chip is to be bonded and that is used to make a connection with the semiconductor chip, an insulating film (6) that is formed on the bonding surface and that has an opening (6a) to expose the connection electrode, and a low-melting-point metallic part (16) that is provided on the connection electrode in the opening and that is made of a low-melting-point metallic material whose solidus temperature is lower than that of the connection electrode.

REFERENCES:
patent: 6774490 (2004-08-01), Soga et al.
patent: 2002/0121709 (2002-09-01), Matsuki et al.
patent: 2003/0151141 (2003-08-01), Matsuki et al.
patent: 2004/0169286 (2004-09-01), Shibata
patent: 49-033564 (1974-03-01), None
patent: 9-082759 (1997-03-01), None
Chua Khoon Lam et al., “Assembly and Reliability Performance of Flip Chip with No-flow Underfills”, 2003 Electronics Packaging Technology Conference, pp. 336-341.

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