Wiring board providing impedance matching

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

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Details

C257SE23062, C257SE23063, C257SE23067, C257SE23079, C257SE23070, C257S774000, C257S700000, C257S698000, C257S701000, C257S702000, C257S758000, C361S316000, C361S760000, C361S761000, C174S260000

Reexamination Certificate

active

07339260

ABSTRACT:
A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z0; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an interaxis distance between said signal through-hole conductor and said shield through-hole conductor is adjusted as defined herein.

REFERENCES:
patent: 6178093 (2001-01-01), Bhatt et al.
patent: 2005/0211561 (2005-09-01), En
patent: 2005/0218502 (2005-10-01), Sunohara et al.
patent: 2006/0000877 (2006-01-01), Wang
patent: 11176984 (1999-07-01), None
patent: 2000077808 (2000-03-01), None
patent: 2001-160598 (2001-06-01), None
patent: 2004-158553 (2004-06-01), None

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