Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-03-13
2007-03-13
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S125000, C029S830000, C029S846000, C428S473500, C428S425900, C361S751000, C361S760000, C361S783000
Reexamination Certificate
active
10792266
ABSTRACT:
A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied to the receiving layer and the interconnecting layer to cure the thermosetting resin precursor and to bond the conductive particles together.
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Communication from Japanese Patent Office regarding related application.
Communication from Japanese Patent Office re: related application.
Kurosawa Hirofumi
Miki Hiroshi
Otsuki Tetsuya
Jr. Carl Whitehead
Rodgers Colleen E.
Seiko Epson Corporation
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