Wiring board, method for manufacturing wiring board and...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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Details

C257S693000, C257S698000, C257S774000

Reexamination Certificate

active

10348478

ABSTRACT:
A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

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Notification of Reasons for Refusal for counterpart Japanese Patent Application No. 2002-248829, mailed on Oct. 17, 2006.

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