Wiring board manufacturing method

Details Wiring board manufacturing method Wiring board manufacturing method

2008-05-13

2008-05-13

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S840000, C029S852000

Reexamination Certificate

active

07370411

ABSTRACT:
A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least one semiconductor chip on the first insulating layer; forming a second insulating layer on the reinforcing member and the semiconductor chip; and forming a wiring on the second insulating layer, the wiring being connected to the semiconductor chip.

REFERENCES:
patent: 4737395 (1988-04-01), Mabuchi et al.
patent: 4773955 (1988-09-01), Mabuchi et al.
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6121553 (2000-09-01), Shinada et al.
patent: 6853087 (2005-02-01), Neuhaus et al.
patent: 2006/0208356 (2006-09-01), Yamano et al.
patent: 2001-217381 (2001-08-01), None
U.S. Appl. No. 11/372,916, Wiring Board and Method of Manufacturing the Same, Takaharu Yamano et al., filed Mar. 10, 2006.

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