Wiring board having connecting wiring between electrode...

Details Wiring board having connecting wiring between electrode... Wiring board having connecting wiring between electrode...

2008-01-22

2008-01-22

Le, Thao X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S750000, C257S758000, C257S691000, C257S760000, C257S748000, C257SE23001, C257SE23005, C257SE23194

Reexamination Certificate

active

11274182

ABSTRACT:
It is to provide a wiring board for a semiconductor integrated circuit package, which exhibits an excellent signal property and a high effect for decreasing the switching noise at the time of mounting an LSI of an area-array structure. In a multilayer wiring board for a package, which comprises, on a wiring layer of an LSI chip mount surface, a ground pad, a power supply pad, and a signal pad for mounting LSI chip, and a ground plane that extends around a group of those pads, the ground pad disposed on the inner side, among the above-described pads, is connected to the ground plane that surrounds the pad group through a connecting wiring.

REFERENCES:
patent: 6329228 (2001-12-01), Terashima
patent: 6483714 (2002-11-01), Kabumoto et al.
patent: 2002/0050407 (2002-05-01), Sohn et al.
patent: 2004/0122279 (2004-06-01), Faulkner et al.
patent: 2001-024084 (2001-01-01), None
patent: 02001015636 (2001-01-01), None
patent: 2001-308222 (2001-11-01), None

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