Wiring board design aiding apparatus, design aiding method,...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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Details

C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

10151368

ABSTRACT:
In a design aiding apparatus of the present invention, a plane clearance setting unit acquires information showing a predetermined margin, a component placement unit determines a placement area of a component such that, as seen in a lamination direction of a multilayer wiring board, at least one of the component and a pad connected to the component is included within a candidate area of a plane foil excluding a perimeter area, and a wiring unit determines a placement area of a wiring foil and a via in the same way that the placement area of the component is determined. Furthermore, in regard to a component, a component pad, a wiring foil, and a via whose placement areas have already been determined, a component placement inspection unit reports a design condition violation if the placement area of at least one of the component and the pad deviates outside the candidate area as seen in the lamination direction of the board, and a wiring inspection unit reports a design condition violation if the placement area of the wiring foil or the via deviates outside the candidate area as seen in the lamination direction of the board.

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