Wiring board and process for producing the same

Details Wiring board and process for producing the same Wiring board and process for producing the same

2007-05-15

2007-05-15

Norton, Nadine G. (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C216S013000, C216S017000, C216S018000, C216S020000, C361S760000, C361S794000, C257S700000, C257S738000, C257S758000, C257S780000

Reexamination Certificate

active

11073615

ABSTRACT:
A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.

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patent: 2001-077238 (2001-03-01), None

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