Wiring board and method of manufacturing the same, and...

Details Wiring board and method of manufacturing the same, and... Wiring board and method of manufacturing the same, and...

2008-12-11

2010-12-28

Hoang, Quoc D (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23013, C257SE23047

Reexamination Certificate

active

07859121

ABSTRACT:
A wiring board is provided with an external connection terminal to which an electrode terminal of an electronic component is to be connected. The external connection terminal is formed so that a portion thereof is electrically connected to a pad portion exposed from an outermost insulating layer on an electronic component mounting surface of a wiring board body and so that an air gap is kept between a portion of the external connection terminal, to which the electrode terminal of the electronic component is to be connected, and the insulating layer.

REFERENCES:
patent: 6333565 (2001-12-01), Hashimoto
patent: 6484395 (2002-11-01), Marcus et al.
patent: 6583516 (2003-06-01), Hashimoto
patent: 6900548 (2005-05-01), Hashimoto
patent: 7038323 (2006-05-01), Hashimoto
patent: 7271499 (2007-09-01), Hashimoto
patent: 7420285 (2008-09-01), Hashimoto
patent: 11-195676 (1999-07-01), None
patent: 2005-354120 (2005-12-01), None

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