Wiring board and its production process

Details Wiring board and its production process Wiring board and its production process

2006-06-06

2006-06-06

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S901000, C174S250000, C174S255000

Reexamination Certificate

active

07056571

ABSTRACT:
There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate, wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except for top portions of the yarns.

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patent: 6558780 (2003-05-01), Suzuki et al.
patent: 1 275 696 (2003-01-01), None
patent: 2001-339130 (2001-12-01), None

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