Wireless interface probe card for high speed one-shot wafer...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07880490

ABSTRACT:
A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

REFERENCES:
patent: 6002375 (1999-12-01), Corman et al.
patent: 6292006 (2001-09-01), Fredrickson
patent: 6563333 (2003-05-01), Hatamian
patent: 6685202 (2004-02-01), Fujimoto
patent: 7076217 (2006-07-01), Luff et al.
patent: 7109730 (2006-09-01), Slupsky
patent: 2005/0086021 (2005-04-01), Khandros et al.
patent: 2005/0174131 (2005-08-01), Miller
patent: 2005/0225347 (2005-10-01), Khandros et al.
patent: 2005/0237073 (2005-10-01), Miller et al.
patent: 2004-253561 (2004-09-01), None
patent: 2004-0048254 (2004-06-01), None
patent: WO 2005/103740 (2005-11-01), None
English language abstract of Korean Publication No. 2004-0048254.
English language abstract of Japanese Publication No. 2004-253561.

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