Wireless communications system employing a chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S723000, C257S700000

Reexamination Certificate

active

06838763

ABSTRACT:
A wireless communication system comprising a carrier having a top and a bottom surface, and a plurality of integrated circuit components for transmitting and receiving communication signals located on the top and bottom surfaces of the carrier. At least one passageway extends through the carrier, and conductive material extends through the passageway for electrically interconnecting the integrated circuit components located on the top and bottom surfaces of the carrier.

REFERENCES:
patent: 5258648 (1993-11-01), Lin
patent: 5399898 (1995-03-01), Rostoker
patent: 5682062 (1997-10-01), Gaul
patent: 5770889 (1998-06-01), Rostoker et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5926951 (1999-07-01), Khandros et al.
patent: 6187677 (2001-02-01), Ahn
patent: 6507076 (2003-01-01), Inoue
L. M. Burns, “Applications for GaAs and Silicon ICs in Next Generation Wireless Communication Systems”, Technical Digest, 1994, 16thAnnual GaAs IC Symposium, p. 155-158, 1994.
N. Yoshikawa et al, “Multi-layer Microwave Integrated Circuit Technology for GaAs Power Amplifier of Personal Communication System”, Technical Digest of 1995, International Solid State Circuit Conference, p. 190-191, p. 365, 1995.
Y. Notani et al, “GaAs Multi-chip Power Amplifier Module suing a Multi-layer TAB Tape”, Technical Digest, 1994 16thAnnual GaAs IC Symposium, p. 145-148, 1994.
F. McGrath et al, “A 1.9 GHz GaAs Chip Set for the Personal Handyphone System”, IEEE Transn on Microwave Theory and Techniques, vol. 43, No. 7, p. 1733-1744, 1995.
J. M. Moniz, “Is SiGe The Future of GaAs for RF Applications?”, Technical Digest, 1997 19thAnnual GaAs IC Symposium, p. 229-231, 1997.
R. M. Rodrigo et al, “AlGaAs/GaAs HEMT 5-12 GHz Integrated System for an Optical Receiver”, Proceedings of the 1998 IEEE International Symposium on Circuits and Systems, vol. 2, p. 312-315, 1998.

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