Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-09-28
2010-06-08
Le, Thao X (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257SE25006, C438S123000
Reexamination Certificate
active
07732900
ABSTRACT:
A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer3is formed on a supporting board2, and a conductive pattern4is formed on the insulating base layer3so that a number of lines of wire4a, 4b, 4c, 4d, magnetic head connecting terminals7, and external connecting terminals8are integrally formed and also first through holes9are formed in the external connecting terminals8. Thereafter, after an insulating cover layer10is formed, third through holes20and second through holes19are formed in the supporting board2and in the insulating base layer3, respectively, to communicate with the first through holes9. This can provide the result that when the external connecting terminals8are connected to the external terminals23, the connection can be performed while confirming the placement of the solder balls21from the respective through holes.
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Kanagawa Hitoki
Ohsawa Tetsuya
Ooyabu Yasunari
Akerman & Senterfitt
Arora Ajay K
Edwards, Esq. Jean C.
Le Thao X
Nitto Denko Corporation
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