Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1997-10-27
2000-01-25
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257772, 257779, 257705, 257738, H01L 2348, H01L 2352, H01L 2940
Patent
active
060181974
ABSTRACT:
A wired ceramic board has on a main surface of a ceramic substrate thereof a plurality of bonding pads each of which has a projection having a solderable outer surface and positioned inside an outer periphery of each bonding pad when observed in a plan view. To each bonding pad is bonded a solder ball by using solder which is lower in melting point than the solder ball. The ceramic board and a resinous printed board are placed one upon another in such a manner that their bonding pads are aligned with each other. The bonding pads are soldered together with low melting point solder. The projection of each bonding pad is embedded in or surrounded by a mass of low melting point solder and joined with the mass of solder to constitute an integral unit while serving as a core of the unit. A shearing force acting on the assembly of the ceramic board and the plastic or resinous board parallel to the main surface of the ceramic board due to a temperature variation is applied by way of the mass of solder to the projection to be supported thereby, whereby to prevent initiation and growth of a crack or cracks in the mass of solder.
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Patent Abstract of Japan, vol. 96, No. 006, Jun. 28, 1996.
Saiki Hajime
Yamasaki Kozo
Clark Jhihan B
NGK Spark Plug Co. Ltd.
Saadat Mahshid
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