Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-07-01
2008-07-01
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S617000, C257SE21509
Reexamination Certificate
active
07393772
ABSTRACT:
A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C.
REFERENCES:
patent: 3623649 (1971-11-01), Keisling
patent: 5172212 (1992-12-01), Baba
patent: 5442239 (1995-08-01), DiGiacomo et al.
patent: 5734200 (1998-03-01), Hsue et al.
patent: 6144100 (2000-11-01), Shen et al.
patent: 6218732 (2001-04-01), Russell et al.
patent: 6265300 (2001-07-01), Bhansali et al.
patent: 6329722 (2001-12-01), Shih et al.
patent: 6335104 (2002-01-01), Sambucetti et al.
patent: 6362531 (2002-03-01), Stamper et al.
patent: 6373137 (2002-04-01), McTeer
patent: 6417088 (2002-07-01), Ho et al.
patent: 6544880 (2003-04-01), Akram
patent: 6569767 (2003-05-01), Fujisawa et al.
patent: 6613671 (2003-09-01), Chopra et al.
patent: 6620720 (2003-09-01), Moyer et al.
patent: 6683383 (2004-01-01), Gleixner et al.
patent: 6798050 (2004-09-01), Homma et al.
patent: 6800555 (2004-10-01), Test et al.
patent: 2002/0100794 (2002-08-01), Ho et al.
patent: 1139413 (2001-10-01), None
patent: 1146552 (2001-10-01), None
patent: 5-102063 (1993-04-01), None
Danielson Donald
Gleixner Robert J.
Naik Rajan
Paluda Patrick M.
Geyer Scott B.
Guglielmi David
Intel Corporation
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