Wirebond lead system with improved wire separation

Details Wirebond lead system with improved wire separation Wirebond lead system with improved wire separation

1994-12-21

1996-06-25

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257692, 257674, H01L 2348, H01L 2350

Patent

active

055302815

ABSTRACT:
Lead systems of the subject invention include "coplanar leads" and "aplanar leads", which differ in structure at the inner bond finger. Coplanar leads are generally planar along the lead body and the inner bond finger. Aplanar leads are bent or deformed at the inner bond finger, such that the inner bond finger terminus is not in the plane of the lead body but instead is above or below the plane of the lead body. Deforming select inner bond fingers out of the general plane of the lead system provides a spatial separation for the bonding wires which are attached to the inner bond fingers. This spatial separation acts to minimize wire crossing and shorting during fill processes and results in improved semiconductor package yield.

REFERENCES:
patent: 4987473 (1991-01-01), Johnson
patent: 5291059 (1994-03-01), Ishitsuka et al.

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