Stone working – Sawing – Rotary
Patent
1997-10-28
1999-08-31
Rose, Robert A.
Stone working
Sawing
Rotary
125 1302, 125 1602, 125 21, 83821, B28D 102
Patent
active
059440074
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to a wire-type slicing machine and method suitable for cutting a so-called brittle material such as a semiconductor material, magnetic material or ceramic into wafer-shaped slices.
PRIOR ART AND PROBLEMS THEREOF
As shown in FIGS. 50 and 51, a wire-type slicing machine, which is also referred to as a wire saw, has three grooved rolls 601, 602 and 603 arranged in parallel to one another at positions which correspond to the vertices of a triangle having a shape near that of a regular triangle. A cutting wire 604 is engaged with the grooves of the grooved rolls 601.about.603 under tension such that the turns of the wire lie parallel and at regular intervals. While the wire 604 is being made to travel in one direction and a working fluid which contains an abrasive (grain) is blown from a nozzle (not shown), a workpiece 600 is pushed against the horizontally traveling wire 604 and is cut crosswise into slices.
In FIG. 50 the workpiece 600 is held below the grooved rolls 603 and 602. The workpiece 600 is sliced by being pushed upward toward the wire 604 traveling horizontally between the grooved rolls 603 and 602. In FIG. 51 the workpiece 600 is held above the grooved rolls 602 and 603. The workpiece 600 is sliced by being pushed downward toward the wire 604 traveling horizontally between the grooved rolls 602 and 603.
An increase in semiconductor wafer diameter is desired in order to improve productivity especially in the semiconductor industry. A large-diameter semiconductor crystal rod (workpiece) is prepared in order to manufacture a large-diameter wafer. It goes without saying that the wire-type slicing machine also is increased in size in order to slice a large-diameter rod.
In a machine for slicing a workpiece while the workpiece is moved up or down, as shown in FIGS. 50 and 51, an increase in the diameter of the workpiece inevitably results in an apparatus having a large height. When the apparatus is made large in height, the frame, etc. is required to have a high rigidity so that a high accuracy is maintained. There is also a decline in operability, such as the handling of the cutting wire and the mounting and unmounting of the workpiece. Furthermore, the working fluid containing the abrasive accumulates and solidifies in grooves cut in the workpiece in the apparatus having the configuration shown in FIG. 50, as a result of which slicing efficiency declines. Another problem is that in the apparatus having the configuration shown in FIG. 51, the working fluid trickles down and does not readily penetrate to the cut surface.
DISCLOSURE OF THE INVENTION
An object of the present invention is to provide a wire-type slicing machine and method in which the height of the machine can be reduced.
Another object of the present invention is to provide a wire-type slicing machine and method in which operability is improved.
A further object of the present invention is to provide a wire-type slicing machine and method as well as a grooved roll unit through which maintenance is facilitated.
A further object of the present invention is to prevent or reduce deflection of a cutting wire which travels between two grooved rolls.
A further object of the present invention is to so arrange it that the tension of the cutting wire can be adjusted continuously.
A further object of the present invention is to lighten the weight of a bobbin which takes up the cutting wire.
A further object of the present invention is to stabilize the travel of the cutting wire in a mechanism, such as a dancer mechanism or capstan mechanism, which includes a plurality of rolls, wherein the cutting wire is engaged with the rolls a plurality of times.
A further object of the present invention is to provide a workpiece holder in which the angular position of a workpiece is capable of being adjusted stably in two directions.
A further object of the present invention is to provide a winding direction sensor capable of automatically sensing the winding direction of a wire wound upon a bobbin.
A further object o
REFERENCES:
patent: 4848200 (1989-07-01), McGehee
patent: 5099820 (1992-03-01), Stricot
patent: 5201305 (1993-04-01), Takeuchi
patent: 5628301 (1997-05-01), Katamachi
Microfilm of Japanese Utility Model Application No. 131184/1976.
Chiba Akihiro
Goto Yasuharu
Miyoshi Kotaro
Suzuki Toshiyuki
Takahashi Koyoshi
Nguyen George
Rose Robert A.
Tokyo Rope Mfg. Co. Ltd.
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