Abrading – Precision device or process - or with condition responsive... – With indicating
Patent
1996-02-21
1997-04-01
Smith, James G.
Abrading
Precision device or process - or with condition responsive...
With indicating
125 2301, 125 21, 125 1601, 125 1602, B24B 4900
Patent
active
056160658
ABSTRACT:
A sawing method and a wire saw for cutting wafers from a workpiece comprises a guidance system for the guidance of wire segments into the intended cutting planes, having at least one measuring device and at least one controlling device, the measuring device detecting an incorrect position of the wire segments in relation to the intended cutting planes by measuring the distance to a measurement point whose spatial position is dependent on the incorrect position of the wire segments, and the controlling device effecting, if necessary, a compensating movement by means of force transmission, which compensating movement brings the wire segments into the intended cutting planes.
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Banks Derris H.
Smith James G.
Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktienges
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