Wire mesh insert for thermal adhesives

Details Wire mesh insert for thermal adhesives Wire mesh insert for thermal adhesives

1997-06-06

1999-08-17

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438119, H01L 2144, H01L 2148, H01L 2150

Patent

active

059406879

ABSTRACT:
Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

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