4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

John G. Davis

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Equipment container retention and bonding system and method

Electricity: conductors and insulators – Anti-inductive structures – Shielded
Reexamination Certificate

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Method and composition for mounting an electronic component...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate

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Method and composition for mounting an electronic component...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Particle spacing and metering device

Dispensing – With discharge assistant – Plural
Patent

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Process of manufacturing a removably interlockable assembly

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-535886

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