Wire fixation structure

Details Wire fixation structure Wire fixation structure

1997-05-29

1999-11-09

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, H01L 23495

Patent

active

059820250

ABSTRACT:
A lead structure includes an insulating film, a plurality of leads, and a plurality of adhesive layers separately provided on the insulating film. Two adjacent leads are fixed by adjacent adhesive layers, respectively, such that an adhesive does not exist on the insulating film between the adjacent adhesive layers. Therefore, ion migration between the leads through the adhesive layer can be prevented.

REFERENCES:
patent: 4801999 (1989-01-01), Hayward et al.
patent: 5723899 (1998-03-01), Shin

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