Wire bonding system and method of use

Details Wire bonding system and method of use Wire bonding system and method of use

2007-04-03

2007-04-03

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S685000, C257S686000, C257S712000, C257S713000, C257SE33075, C257SE23051

Reexamination Certificate

active

11100642

ABSTRACT:
A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.

REFERENCES:
patent: 5172301 (1992-12-01), Schneider
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5739586 (1998-04-01), Cannizzaro et al.
patent: 6337226 (2002-01-01), Symons
patent: 62-274755 (1987-11-01), None
patent: 63-222450 (1988-09-01), None
patent: 2001-0025874 (2001-04-01), None
patent: 2001-0055041 (2001-07-01), None

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