Wire-bonding method, wire-bonding apparatus,and semiconductor de

Details Wire-bonding method, wire-bonding apparatus,and semiconductor de Wire-bonding method, wire-bonding apparatus,and semiconductor de

1990-11-29

1992-10-06

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228205, 228 45, B23K 3102

Patent

active

051524503

ABSTRACT:
The present invention relates to a wire bonding method and a wire bonding apparatus employing a coated wire in which the surface of the metal wire is coated with an insulator, and a semiconductor device produced by the bonding method. The present invention includes forming a metal ball on the front end of the coated wire, e.g., by arc discharge; joining the metal ball to an external terminal of a semiconductor chip; bringing the rear end of the coated wire into contact with an external lead and destroying the insulator coating where the coated wire contacts the lead; and joining the metal wire at the rear end of the coated wire to the lead. The metal wire is connected to a common ground with the bonding device, during the arc discharge, and the wire is positive relative to the discharge electrode. Moreover, the melting and shrinking insulator of the coated wire is blown away, and insulator globes can be prevented from being formed in the coated wire, so that bonding defects are avoidable.

REFERENCES:
patent: 3789183 (1974-01-01), Conley
patent: 4387283 (1983-06-01), Peterson
patent: 4572772 (1986-02-01), Peterson
patent: 4575602 (1986-03-01), Sakurai
patent: 4580713 (1986-04-01), Sekibata et al.
patent: 4594493 (1986-06-01), Harrah et al.
patent: 4611747 (1986-09-01), Peppler et al.
patent: 4674671 (1987-06-01), Fister et al.
patent: 4705204 (1987-11-01), Hirota et al.
patent: 4950866 (1990-08-01), Kojima

Affiliated with

Also associated with

Rating

Wire-bonding method, wire-bonding apparatus,and semiconductor de does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire-bonding method, wire-bonding apparatus,and semiconductor de, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire-bonding method, wire-bonding apparatus,and semiconductor de will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1184159