Wire-bonding method, wire-bonding apparatus, and semiconductor d

Details Wire-bonding method, wire-bonding apparatus, and semiconductor d Wire-bonding method, wire-bonding apparatus, and semiconductor d

1988-01-26

1991-03-05

Shaw, Clifford C.

Electric heating

Metal heating

Wire, rod, or bar bonding

228 45, B23K 900

Patent

active

049980025

ABSTRACT:
A semiconductor device is fabricated by placing a semiconductor chip with at least one bonding pad on the bonding stage of a wire bonder. A coated wire on a spool is passed through a bore in a bonding capillary so that one end of the wire projects from the lower tip of the capillary. An electrical arc discharge is created between the wire tip projecting from the capillary and a discharge electrode by applying a first electric potential to this wire tip through the opposite end of the wire and applying a second electric potential to the electrode. A ball is formed on the end of the wire and this ball is bonded to the pad with the lower tip of the capillary.

REFERENCES:
patent: 3125906 (1964-03-01), Johnson
patent: 4575602 (1986-03-01), Sakurai
patent: 4580713 (1986-04-01), Sekibata et al.

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