Wire bonding method, semiconductor chip, and semiconductor...

Details Wire bonding method, semiconductor chip, and semiconductor... Wire bonding method, semiconductor chip, and semiconductor...

2006-06-27

2006-06-27

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S784000, C257S785000

Reexamination Certificate

active

07067413

ABSTRACT:
A method of wire bonding, a semiconductor chip, and a semiconductor package provides stitch-stitch bonds of a wire on a bond pad of a chip as well as on a bond position of a substrate. A ball-stitch bump is formed on an end of the wire extending from a capillary or provided on the bond pad of the chip. A ball-stitch bump is formed on the bond pad of the chip by pressing down the ball of the wire on the bond pad. A ball-stitch stitch bond of the wire is formed on the ball-stitch bump by pressing down the wire on the ball-stitch bump. The capillary is moved from the bond pad to the bond position, while loosening the wire. A stitch bond of the wire is formed on the bond position by pressing down the wire on the bond position, and then separated from the wire within the capillary. The method of wire bonding, a semiconductor chip, and a semiconductor package can reduce or minimize a moving path of the capillary and provide more effective wire bonding.

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