Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

1998-12-28

2000-12-26

Ryan, Patrick

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228106, 2281805, B23K 3102, B23K 3700

Patent

active

061645184

ABSTRACT:
So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

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patent: 5323952 (1994-06-01), Kato et al.
patent: 5443200 (1995-08-01), Arikado
patent: 5586713 (1996-12-01), Arita et al.

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