Wire bonding method

Details Wire bonding method Wire bonding method

1998-04-24

1999-10-12

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438106, 438108, 438118, H01L 2144

Patent

active

059666307

ABSTRACT:
A wire bonding method in which an electric spark is generated between a lower end of a wire inserted through a capillary tool and a torch so as to form a small diameter ball, and then the electric spark is again generated so as to increase the diameter of the ball to form a large ball. The large ball is pressed against a pad on a chip with a lower surface of the capillary tool, so that the large ball is bonded to the pad. Since the large ball is soft, it can be sufficiently crushed by the lower surface of the capillary tool and be tightly bonded to the pad. Accordingly, the method accomplishes excellent wire bonding immediately after a bonding operation is restarted even after a long waiting time between bonding operations.

REFERENCES:
patent: 5302550 (1994-04-01), Hirota et al.
patent: 5349234 (1994-09-01), DesJardin et al.
patent: 5668058 (1997-09-01), Tanioka et al.

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