Wire bonding method

Details Wire bonding method Wire bonding method

1994-09-21

1996-06-11

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using high frequency vibratory energy

2281805, H01L 21607

Patent

active

055248110

ABSTRACT:
In a bonding method for bonding with a wire a first bonding point and then a second bonding point, a capillary that carries the wire is moved in a direction which is opposite from the first bonding point at the same time that an ultrasonic vibration is applied to the capillary during bonding to the second bonding point. Such a movement of the opposite direction can occur 10-20 ms after the application of the ultrasonic vibration at the second bonding point.

REFERENCES:
patent: 5111989 (1992-05-01), Holdgrafer et al.

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