Wire bonding method

Details Wire bonding method Wire bonding method

1990-10-23

1992-08-11

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228179, H01L 21607

Patent

active

051372010

ABSTRACT:
A wire bonding method that uses plurality of bonders so that each samples treated by the respective bonders are collected via single sample correcting line, in which bonders perform bondings at different points on the samples and/or performs marking bonds at different points thereon, resulting in that the bonder that has performed the bonding can be easily recognized by examining bonding points.

REFERENCES:
patent: 3973713 (1976-08-01), Furuya et al.
patent: 4855928 (1989-08-01), Yamanaka
patent: 4982728 (1991-01-01), Masuda et al.
patent: 4986460 (1991-01-01), Yamazaki et al.

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